Sales Manager: Mr. Peng
Tel: +86 136 0112 5769
E-mail:sales@technol.cn
Feature/Function:
* Dual-use sputtering and evaporation function, less occupied area, competitive price, stable performance and low maintenance costs;
* Can be used for the preparation of single and multi-layer metal film, dielectric film, semiconductor film, magnetic film, sensor film, heat-resistant alloy film, hard film, corrosion-resistant film, etc.;
* Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc .;
* Single target sputtering, multi-target sputtering in turns, multi-target sputtering simultaneously and so on functions.
Application: Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.
Technical Parameters
Equipment Name | Magnetron Sputtering System |
Model | JCP200 |
Chamber Structure | Vertical top cover structure, bottom pumping system, manual pneumatic spring pull open type |
Chamber Size | Φ210×H310mm |
Baking Temperature | Room temperature~350℃(662℉) |
Sputtering Path | Upward |
Rotating Substrate Holder | Φ100mm |
Film Thickness Nonuniformity | Within the scope of Φ50mm≤±5.0% |
Sputtering Target/Evaporation Electrode | 1 Pc of Φ2 Inches magnetron target, reserved 1 group of evaporation electrode interface |
Process Gas | 1-2 Routes gas flow control |
Control Method | PLC Control/IPC automatic control(optional) |
Occupied Area | (Mainframe) L600×W800×H1700mm |
Power | ≥7kW |