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Sputtering & Evaporation

Magnetron Sputtering System JCP200

Feature/Function:

* Dual-use sputtering and evaporation function, less occupied area, competitive price, stable performance and low maintenance costs;

* Can be used for the preparation of single and multi-layer metal film, dielectric film, semiconductor film, magnetic film, sensor film, heat-resistant alloy film, hard film, corrosion-resistant film, etc.;

* Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc .;

 * Single target sputtering, multi-target sputtering in turns, multi-target sputtering simultaneously and so on functions.


Application: Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.


Technical Parameters

Equipment NameMagnetron Sputtering System
ModelJCP200
Chamber Structure

Vertical top cover structure, bottom pumping system, manual

 pneumatic spring pull open type

Chamber SizeΦ210×H310mm
Baking TemperatureRoom temperature~350(662)
Sputtering PathUpward
Rotating Substrate HolderΦ100mm
Film Thickness NonuniformityWithin the scope of Φ50mm≤±5.0%

Sputtering Target/Evaporation

 Electrode

1 Pc of Φ2 Inches magnetron target, reserved 1 group of evaporation

 electrode interface

Process Gas1-2 Routes gas flow control
Control MethodPLC Control/IPC automatic control(optional) 
Occupied Area(Mainframe) L600×W800×H1700mm
Power≥7kW