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Magnetron Sputtering

Magnetron Sputtering System JCP500

Feature/Function:

* Less occupied area, competitive price, stable performance and low maintenance costs;
* Can be used for the preparation of single and multi-layer metal film, dielectric film, semiconductor film, magnetic film, sensor film, heat-resistant alloy film, hard film, corrosion-resistant film, etc.;
* Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc .;
* Single target sputtering, multi-target sputtering in turns, multi-target sputtering simultaneously and so on functions.


Application: Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.


Technical Parameters

Equipment NameMagnetron Sputtering System
ModelJCP500
Chamber StructureVertical front door structure, rear pumping system
Chamber SizeΦ500×H420mm
Baking TemperatureRoom temperature~500(932)
Sputtering PathUpward/downward(optional)
Rotating Substrate HolderΦ150mm
Film Thickness NonuniformityWithin the scope of Φ100mm≤±5.0%

Sputtering Target/Evaporation

 Electrode

2~4 Pcs of Φ2, Φ3, Φ4 Inches magnetron targets (optional)
Process Gas2-3 Routes gas flow control
Control MethodPLC Control/IPC automatic control(optional) 
Occupied Area(Mainframe) L1800×W800×H1900mm
Power≥15kW