Sales Manager: Mr. Peng
Tel: +86 136 0112 5769
E-mail:sales@technol.cn
Feature/Function:
* Less occupied area, competitive price, stable performance and low maintenance costs;
* Can be used for the preparation of single and multi-layer metal
film, dielectric film, semiconductor film, magnetic film, sensor film, heat-resistant alloy film, hard film, corrosion-resistant film, etc.;
* Coating samples: silver, aluminum, copper, nickel, chromium, nickel-chromium alloy, titanium oxide, ITO, silica, etc .;
* Single target sputtering, multi-target sputtering in turns, multi-target sputtering simultaneously and so on functions.
Application: Colleges & universities, research institutes and enterprises develop new thin film materials and samll batch production.
Technical Parameters
| Equipment Name | Magnetron Sputtering System |
| Model | JCPY500 |
| Chamber Structure | Vertical front door structure, rear pumping system, double-layer water cooling |
| Chamber Size | Φ500×H450mm, with Load-Lock function, supports taking in/out single or multiple substrates |
| Baking Temperature | Room temperature~500℃(932℉) |
| Sputtering Path | Upward |
| Rotating Substrate Holder | Φ150mm |
| Film Thickness Nonuniformity | Within the scope of Φ100mm≤±5.0% |
Sputtering Target/Evaporation Electrode | 2~4 Pcs of Φ2, Φ3, Φ4 Inches magnetron targets (optional) |
| Process Gas | 3 Routes gas flow control |
| Control Method | PLC Control/IPC automatic control(optional) |
| Occupied Area | (Mainframe) L1800×W800×H1845mm |
| Power | ≥15kW |
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